Researchers at the University of Massachusetts Amherst have developed a new method for aligning 3D semiconductor chips by shining a laser through concentric metalenses patterned onto the chips, creating a hologram. Their work, published in Nature Communications, could significantly reduce the cost of manufacturing 2D chips, support the development of 3D photonic and electronic chips, and open the door to affordable, compact sensor technologies.
Semiconductor chips power electronic devices by enabling them to process, store, and transmit information. These functions rely on precise patterns of components embedded in the chip. However, the traditional 2D chip design has reached the limits of its technological potential, and 3D integration is now seen as the most promising path forward.
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